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Electroplate
Bonding Wire
Name
Kind
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SORT:Bonding Wire | TIME:2006-5-20 18:44:17
Glod Bonging Write

Kanfort gold bonding wire are mainly used in the semiconductor to make chip and the external circuitry electrical connections.By the proper dopants and alloy,kanfort gold bonding wire can settle for all requires of different package.

Diameter
Weight
B.L(g)
E.L
μm
mil
Mg/m
KHl
KM2 KM3
KL1
%
15±1
0.6
2.97-3.88
>2.0
>2.5
>3.0
2.0-5.0
17±1
0.669
3.88-4.90
>3.0
>4.0
>5.0
2.0-6.0
18±1
0.7
4.35-5.48
>3.0
>4.0
>5.0
2.0-6.0
19±1
0.75
4.90-6.10
>4.0
>5.0
>6.0
2.0-6.0
20±1
0.8
5.48-6.70
>4.0
>5.0
>6.0
2.0-6.0
23±1
0.9
7.35-8.75
>6.0
>7.0
>8.0
2.0-8.0
24±1
0.944
8.02-9.48
>7.0
>8.0
>9.0
2.0-8.0
25±1
1.0
8.75-10.26
>8.0
>9.0
>10.0
2.0-8.0
28±1
1.1
11.05-12.75
>10.0
>12.0
>13.0
2.0-8.0
30±1
1.2
12.75-14.60
>12.0
>13.0
>15.0
3.0-10.0
32±1
1.25
14.60-16.50
>12.0
>15.0
>16.0
3.0-10.0
33±1
1.3
15.54-17.50
>14.0
>16.0
>18.0
3.0-10.0
35±1
1.4
17.50-19.65
>15.0
>18.0
>20.0
3.0-10.0
38±1
1.5
20.75-23.10
>18.0
>21.0
>23.0
3.0-10.0
40±1
1.6
23.10-25.50
>22.0
>24.0
>26.0
4.0-12.0
45±1
1.8
29.40-32.10
>26.0
>28.0
>30.0
4.0-12.0
50±1
2.0
34.90-41.00
>32.0
>35.0
>36.0
4.0-12.0
60±1
2.4
49.30-60.25
>48.0
>51.0
>53.0
8.0-15.0
70±1
2.8
68.10-80.85
>56.0
>60.0
>62.0
8.0-15.0
75±1
3
78.65-92.30
>66.0
>68.0
>72.0
8.0-15.0
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